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Design delivers LED requirements as well as cost savings in materials and future reel-to-reel manufacturing opportunities
June 5, 2014
By: DAVID SAVASTANO
Editor, Ink World Magazine
3M Electronics Materials Solutions Division announced the launch of its new 3M LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic substrates. The new substrate, constructed of copper and polyimide, is able to meet the electrical and thermal performance required of high-power LED chips at a competitive price compared to high performance ceramic substrates. 3M offers the substrate in a tray and a reel format. 3M’s substrate in reel format will help the industry’...
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